Intel® Socket 2066 Core™ X-Series Processors ; * The Intel® Turbo Boost Max Technology 3.0 support depends on the CPU types; * Refer to www.asus.com for CPU support list.
Chipset:
Intel® X299
Слотове:
44-Lane CPU: 3 x PCIe 3.0/2.0 x16 (x16
x16/x16
x16/x16/x8) ; 2 x PCIe 3.0 x4 (max at x4 mode); 1 x PCIe 3.0/2.0 x1; 28-Lane CPU: 3 x PCIe 3.0/2.0 x16 (x16
x16/x8
x16/x8/x1); 2 x PCIe 3.0 x4 (max at x4 mode) ; 1 x PCIe 3.0/2.0 x1 ; 16-Lane CPU: 3 x PCIe 3.0/2.0 x16 (x16
x8/x8
x8/x8/x1) ; 2 x PCIe 3.0 x4 (max at x4 mode); 1 x PCIe 3.0/2.0 x1; 1 x PCIe 3.0/2.0 x1 (x1 mode).
Storage:
Intel® X299 Chipset : 1 x M.2 x4 Socket 3
with M key
type 2242/2260/2280 storage devices support (SATA & PCIE 3.0 x 4 mode); 1 x M.2 x4 Socket 3
with M key
type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode); 8 x SATA 6Gb/s port(s); Support Raid 0
Un-buffered Memory ; * Hyper DIMM support is subject to the physical characteristics of individual CPUs. * Refer to www.asus.com for the Memory QVL (Qualified Vendors Lists).
I/O:
1 x LAN (RJ45) port(s); 2 x USB 3.1 Gen 2 Type-A + USB Type-CTM; 4 x USB 3.1 Gen 1 ; 2 x USB 2.0 (one port can be switched to USB BIOS Flashback) ; 1 x Optical S/PDIF out; 5 x Audio jack(s); 1 x USB BIOS Flashback Button(s).
Connectors:
1 x AAFP connector; 2 x Aura RGB Strip Header; 2 x USB 3.1 Gen 1 connector(s) support(s) additional 4 USB 3.1 Gen 1 port(s) ; 1 x USB 2.0 connector(s) support(s) additional 2 USB 2.0 port(s); 1 x M.2 Socket 3 with M key
type 2242/2260/2280 storage devices support (SATA & PCIE 3.0 x 4 mode); 1 x M.2 Socket 3 with M key
type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode); 8 x SATA 6Gb/s connector(s); 1 x M.2_FAN connector; 1 x VROC_HW_Key; 1 x CPU Fan connector(s) ; 1 x CPU OPT Fan connector(s) ; 2 x Chassis Fan connector(s) ; 1 x AIO_PUMP connector ; 1 x W_PUMP+ connector ; 1 x Thunderbolt header(s); 1 x 24-pin EATX Power connector(s); 1 x 8-pin ATX 12V Power connector(s); 1 x 4-pin ATX 12V Power connector(s); 1 x System panel(s) (Q-Connector); 1 x 5-pin EXT_FAN(Extension Fan) connector; 1 x MemOK! button(s); 1 x Thermal sensor connector(s); 1 x Power-on button(s); 1 x Clear CMOS jumper(s); 1 x USB 3.1 Gen 2 front panel connector; 1 x CPU_OV jumper.
Audio:
Realtek® ALC S1220A 8-Channel High Definition Audio CODEC : - Impedance sense for front and rear headphone outputs; - Internal audio Amplifier to enhance the highest quality sound for headphone and speakers; - Supports : Jack-detection
Multi-streaming
Front Panel Jack-retasking; Audio Feature : - DTS Connect; - DTS Headphone:X ; - Optical S/PDIF out port(s) at back panel; - Audio Shielding: Ensures precision analog/digital separation and greatly reduced multi-lateral interference; - Dedicated audio PCB layers: Separate layers for left and right channels to guard the quality of the sensitive audio signals; - Premium Japanese-made audio capacitors: Provide warm
natural and immersive sound with exceptional clarity and fidelity; - Unique de-pop circuit: Reduces start-up popping noise to audio outputs; - EMI protection cover to prevent electrical noise to affect the amplifier quality; Separate layer for left and right track
ensuring both sound deliver equal quality.
LAN:
Intel® I219V
1 x Gigabit LAN Controller(s)
featuring Turbo LAN; ASUS Turbo LAN Utility; ASUS LAN Guard.
BIOS:
128 Mb Flash ROM
UEFI AMI BIOS
PnP
DMI3.0
WfM2.0
SM BIOS 3.0
ACPI 6.0
Multi-language BIOS
ASUS EZ Flash 3
CrashFree BIOS 3
F11 EZ Tuning Wizard
F6 Qfan Control
F3 My Favorites
Last Modified log
F12;PrintScreen and ASUS DRAM SPD (Serial Presence Detect) memory information.
Form Factor:
ATX Form Factor ; 12 inch x 9.6 inch ( 30.5 cm x 24.4 cm ).
Операционна система:
Windows® 10 64-bit
Други:
Realtek® ALC S1220A 8-Channel High Definition Audio CODEC: - Impedance sense for front and rear headphone outputs; - Internal audio Amplifier to enhance the highest quality sound for headphone and speakers; - Supports : Jack-detection
Multi-streaming
Front Panel Jack-retasking; Audio Feature : - DTS Connect; - DTS Headphone:X ; - Optical S/PDIF out port(s) at back panel; - Audio Shielding: Ensures precision analog/digital separation and greatly reduced multi-lateral interference; - Dedicated audio PCB layers: Separate layers for left and right channels to guard the quality of the sensitive audio signals; - Premium Japanese-made audio capacitors: Provide warm
natural and immersive sound with exceptional clarity and fidelity; - Unique de-pop circuit: Reduces start-up popping noise to audio outputs; - EMI protection cover to prevent electrical noise to affect the amplifier quality; Separate layer for left and right track
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